Axxon - Dispensing machine MYC50E

MYC50E

Inline THT bonding that tilts and rotates, placing adhesive exactly where you need it.

Axxon - Dispensing machine MYC50E

MYC50E

Inline THT bonding that tilts and rotates, placing adhesive exactly where you need it.

2 - 6 weeks
Price on request

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    • Independent expertise
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    • Extensive offer
    • More than 50 years of experience

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      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 50 years of experience

      Need a quote, installation, or training?
      Call +32 (0)14 42 44 01 or contact us

      Contact us

      In need direct contact with a sales representative?

      Nick Janssen

      Product specialist

        Or leave your details and we will contact you as soon as possible.

        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 50 years of experience
        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 50 years of experience

        Description

        The MYSmart MYC50E from Axxon Mycronic is an inline dispensing system for THT bonding. It is based on the MYC50 and runs fast and stable. That makes it a good fit for high volume production.

        The machine tilts and rotates under motor control. This lets you apply material precisely around components or between component and PCB. It handles materials with one or two components. The result is a firm bond and better protection for your board.

        Multiple axes control even complex dispensing paths accurately. A high pressure valve handles demanding materials with ease. Fine adjustment is possible at micrometer level. A needle verification module checks the needle automatically. An electronic scale monitors the dispensed amount and keeps quality consistent. You can connect an external feeding system for continuous production. The extended hood with counterbalances keeps hoses neatly managed. Thanks to the modular design, you tailor the machine to your process.

        Specifications

        Dispensing areaup to 600 x 430 mm, or 490 x 320 mm with tilt and rotate
        Footprint (W x D x H)1,290 x 1,364 x 2,120 mm, without light tower
        Load capacity5 kg (10 kg optional)
        Repeatability XY and Z±25 µm at 3σ
        XY speed800 mm/s (peak)
        Z travel100 mm

        The MYSmart MYC50E from Axxon Mycronic is an inline dispensing system for THT bonding. It is based on the MYC50 and runs fast and stable. That makes it a good fit for high volume production.

        The machine tilts and rotates under motor control. This lets you apply material precisely around components or between component and PCB. It handles materials with one or two components. The result is a firm bond and better protection for your board.

        Multiple axes control even complex dispensing paths accurately. A high pressure valve handles demanding materials with ease. Fine adjustment is possible at micrometer level. A needle verification module checks the needle automatically. An electronic scale monitors the dispensed amount and keeps quality consistent. You can connect an external feeding system for continuous production. The extended hood with counterbalances keeps hoses neatly managed. Thanks to the modular design, you tailor the machine to your process.

        Dispensing areaup to 600 x 430 mm, or 490 x 320 mm with tilt and rotate
        Footprint (W x D x H)1,290 x 1,364 x 2,120 mm, without light tower
        Load capacity5 kg (10 kg optional)
        Repeatability XY and Z±25 µm at 3σ
        XY speed800 mm/s (peak)
        Z travel100 mm