Ersa - Rework Station HR 550

ERS-0HR550

Guided rework with high-performance optical system and flexible heating technology

Ersa - Rework Station HR 550

ERS-0HR550

Guided rework with high-performance optical system and flexible heating technology

37.178,57 / STK - In stock (2)

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    • Customers give us a 9+
    • Extensive offer
    • More than 50 years of experience

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      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 50 years of experience
      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 50 years of experience

      Description

      Thanks to guided processes, the Ersa Rework System HR 550 ensures safe rework on the basis of simple and convenient operation. Predicate: visually leading!

      From 01005 chips to large SMT connectors (120 mm), from SMT flip chips to THT pin grid arrays, BGAs on flex circuit or multilayer BGAs – Ersa rework systems offer the optimal solution for all applications.

      • Highly efficient 1.800 W hybrid heating head
      • Large-area IR bottom heating in 3 heating zones (2,400 W)
      • Integrated vacuum pipette for component removal and placement
      • Highly accurate placement with integrated force sensor
      • Enhanced Visual Assistant (EVA)
      • Computer aided component placement
      • Process control and documentation via software HRSoft 2
      • Suitable for the use of the Dip&Print Station

      Specifications

      Dimensions (W x D x H)573 x 765 x 545/747 mm (heating head down/up)
      Weight76 kg
      Antistatic Designyes
      Power Rating4.200 W
      Nominal voltage230 in V AC
      Upper heatingHybrid emitter (900 + 900 W), 70 x 70 mm
      Lower heatingIR emitter (3 x 800 W), 390 x 270 mm
      PCB sizeup to 400 x 300 mm (+x) up to 520 x 360 mm (+x) (0HR550L)
      Component sizefrom 01005 to 70 x 70 mm
      OperationWindows-PC
      Test symbolCE
      OptionReflow process camera: 2,3 MP, CMOS GigE color camera, 25 mm focal length, illumination 2x LED, adjustable

      Thanks to guided processes, the Ersa Rework System HR 550 ensures safe rework on the basis of simple and convenient operation. Predicate: visually leading!

      From 01005 chips to large SMT connectors (120 mm), from SMT flip chips to THT pin grid arrays, BGAs on flex circuit or multilayer BGAs – Ersa rework systems offer the optimal solution for all applications.

      • Highly efficient 1.800 W hybrid heating head
      • Large-area IR bottom heating in 3 heating zones (2,400 W)
      • Integrated vacuum pipette for component removal and placement
      • Highly accurate placement with integrated force sensor
      • Enhanced Visual Assistant (EVA)
      • Computer aided component placement
      • Process control and documentation via software HRSoft 2
      • Suitable for the use of the Dip&Print Station