Ersa - Rework Station HR 550
ERS-0HR550
Guided rework with high-performance optical system and flexible heating technology
Ersa - Rework Station HR 550
ERS-0HR550
Guided rework with high-performance optical system and flexible heating technology
Original price was: €37.178,57.€34.390,00Current price is: €34.390,00. - In stock (1)
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Description
Thanks to guided processes, the Ersa Rework System HR 550 ensures safe rework on the basis of simple and convenient operation. Predicate: visually leading!
From 01005 chips to large SMT connectors (120 mm), from SMT flip chips to THT pin grid arrays, BGAs on flex circuit or multilayer BGAs – Ersa rework systems offer the optimal solution for all applications.
- Highly efficient 1.800 W hybrid heating head
- Large-area IR bottom heating in 3 heating zones (2,400 W)
- Integrated vacuum pipette for component removal and placement
- Highly accurate placement with integrated force sensor
- Enhanced Visual Assistant (EVA)
- Computer aided component placement
- Process control and documentation via software HRSoft 2
- Suitable for the use of the Dip&Print Station
Specifications
Dimensions (W x D x H) | 573 x 765 x 545/747 mm (heating head down/up) |
Weight | 76 kg |
Antistatic Design | yes |
Power Rating | 4.200 W |
Nominal voltage | 230 in V AC |
Upper heating | Hybrid emitter (900 + 900 W), 70 x 70 mm |
Lower heating | IR emitter (3 x 800 W), 390 x 270 mm |
PCB size | up to 400 x 300 mm (+x) up to 520 x 360 mm (+x) (0HR550L) |
Component size | from 01005 to 70 x 70 mm |
Operation | Windows-PC |
Test symbol | CE |
Option | Reflow process camera: 2,3 MP, CMOS GigE color camera, 25 mm focal length, illumination 2x LED, adjustable |
Downloads
Thanks to guided processes, the Ersa Rework System HR 550 ensures safe rework on the basis of simple and convenient operation. Predicate: visually leading!
From 01005 chips to large SMT connectors (120 mm), from SMT flip chips to THT pin grid arrays, BGAs on flex circuit or multilayer BGAs – Ersa rework systems offer the optimal solution for all applications.
- Highly efficient 1.800 W hybrid heating head
- Large-area IR bottom heating in 3 heating zones (2,400 W)
- Integrated vacuum pipette for component removal and placement
- Highly accurate placement with integrated force sensor
- Enhanced Visual Assistant (EVA)
- Computer aided component placement
- Process control and documentation via software HRSoft 2
- Suitable for the use of the Dip&Print Station