Ersa - Selective Soldering Machine VERSAFLOW FIVE
ERS-MSVFFIVE
Ultra-high-end selective soldering designed for demanding applications, such as those in the automotive industry, medical technology, and aerospace
Ersa - Selective Soldering Machine VERSAFLOW FIVE
ERS-MSVFFIVE
Ultra-high-end selective soldering designed for demanding applications, such as those in the automotive industry, medical technology, and aerospace
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Description
With a high degree of automation, the machine enables autonomous production and a significant increase in productivity. It is ideal for electronics manufacturers with high production volumes and changing requirements, as it offers maximum productivity and throughput without compromising on quality.
Technology Highlights
- Automatic nozzle changer and automatic flux nozzle cleaning
- Matrix heating with segmented heating surfaces for flexible heating
- VERSAFLEX 2.0 with synchronous and asynchronous mode
- For assembly formats up to 685 x 508 mm or 2 PCBs up to 350 x 508 mm
- CAD expert mode
Your advantages
- The next step toward autonomous production
- Component-friendly and energy-saving solution saves costs and resources
- Produce different soldering tasks independently side by side for high flexibility and high throughput
- Enables processing of one XL board or 2x standard formats
- Enables manual routing to optimize throughput and cycle time
Features
Automatic nozzle changer
The automatic nozzle changer is a new feature of the VERSAFLOW FIVE, especially for scenarios with frequent program changes and limited operator presence. It replaces manual nozzle changes, thereby increasing the efficiency and process reliability of the entire soldering process.
Segmented heating surfaces
The matrix heater consists of several segments that can be controlled individually. This enables targeted and homogeneous heating of the assemblies, even with complex boards. The segmented structure allows up to six different heating surfaces to be mapped, enabling precise adaptation to the specific requirements of the PCBs.
Automatic flux nozzle cleaning
Automatic flux nozzle cleaning significantly reduces the need for manual intervention, as it automatically removes contamination from dropjet spray heads, thus maintaining consistent spray quality. Especially during periods of low staff availability – such as night shifts or line start-ups – it ensures high process reliability and minimizes downtime.
CAD Expert Mode
The expert mode in CAD Assistant 4 enables manual routing of flux and solder modules to further optimize throughput and cycle time. This feature allows you to specify the order in which the flux modules or solder modules process a PCB. Expert mode is available in both synchronous and asynchronous modes for 2-stopper operation.
Specifications
| Dimensions (LxWxH) | 4100 x 1789 x 1643 mm |
| Heating time | 60 min to 280 °C |
| PCB length | 120-685 mm or 120-350 mm in double stop mode (processing range up to 320 mm) |
| PCB weight | 12 kg (heavy duty 25 kg) |
| PCB width | 50-508mm |
| Soldering module variations | 1-6 mini wave crucibles |
| Solder temperature | max. 320 °C |
| Solder volume | approx. 14 kg Sn63PB, approx. 13 kg lead-free alloy |
| Solder wave height | max. 5 mm |
| Transport clearance | top max. 120 mm (optional 200 mm), bottom max. 80 mm |
| Transport speed | 0.2 m/min to 15 m/min |
With a high degree of automation, the machine enables autonomous production and a significant increase in productivity. It is ideal for electronics manufacturers with high production volumes and changing requirements, as it offers maximum productivity and throughput without compromising on quality.
Technology Highlights
- Automatic nozzle changer and automatic flux nozzle cleaning
- Matrix heating with segmented heating surfaces for flexible heating
- VERSAFLEX 2.0 with synchronous and asynchronous mode
- For assembly formats up to 685 x 508 mm or 2 PCBs up to 350 x 508 mm
- CAD expert mode
Your advantages
- The next step toward autonomous production
- Component-friendly and energy-saving solution saves costs and resources
- Produce different soldering tasks independently side by side for high flexibility and high throughput
- Enables processing of one XL board or 2x standard formats
- Enables manual routing to optimize throughput and cycle time
Features
Automatic nozzle changer
The automatic nozzle changer is a new feature of the VERSAFLOW FIVE, especially for scenarios with frequent program changes and limited operator presence. It replaces manual nozzle changes, thereby increasing the efficiency and process reliability of the entire soldering process.
Segmented heating surfaces
The matrix heater consists of several segments that can be controlled individually. This enables targeted and homogeneous heating of the assemblies, even with complex boards. The segmented structure allows up to six different heating surfaces to be mapped, enabling precise adaptation to the specific requirements of the PCBs.
Automatic flux nozzle cleaning
Automatic flux nozzle cleaning significantly reduces the need for manual intervention, as it automatically removes contamination from dropjet spray heads, thus maintaining consistent spray quality. Especially during periods of low staff availability – such as night shifts or line start-ups – it ensures high process reliability and minimizes downtime.
CAD Expert Mode
The expert mode in CAD Assistant 4 enables manual routing of flux and solder modules to further optimize throughput and cycle time. This feature allows you to specify the order in which the flux modules or solder modules process a PCB. Expert mode is available in both synchronous and asynchronous modes for 2-stopper operation.
| Dimensions (LxWxH) | 4100 x 1789 x 1643 mm |
| Heating time | 60 min to 280 °C |
| PCB length | 120-685 mm or 120-350 mm in double stop mode (processing range up to 320 mm) |
| PCB weight | 12 kg (heavy duty 25 kg) |
| PCB width | 50-508mm |
| Soldering module variations | 1-6 mini wave crucibles |
| Solder temperature | max. 320 °C |
| Solder volume | approx. 14 kg Sn63PB, approx. 13 kg lead-free alloy |
| Solder wave height | max. 5 mm |
| Transport clearance | top max. 120 mm (optional 200 mm), bottom max. 80 mm |
| Transport speed | 0.2 m/min to 15 m/min |











