Ersa - Selective Soldering VERSAFLOW 3/66
AEP-9849d7a7
Modularity for highly flexible selective soldering of XL boards
Ersa - Selective Soldering VERSAFLOW 3/66
AEP-9849d7a7
Modularity for highly flexible selective soldering of XL boards
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Nick Janssen
Product specialist
Description
The VERSAFLOW 3/66 is part of the third generation of Ersa systems and has been specially developed for selective soldering of large printed circuit boards up to 610 x 610 mm. This high-end soldering system combines maximum flexibility with excellent process stability – ideal for demanding electronics production in the XL segment.
Depending on the soldering task and desired throughput, the VERSAFLOW 3/66 can be expanded with additional flux, preheating, and soldering modules. Up to three soldering modules can be integrated, each equipped with one or two single-wave pots for optimal configuration per application.
The machine offers both mini-wave soldering technology for maximum precision and multi-wave options for high-volume production. Thanks to the parallel process structure – in which fluxing, preheating, and soldering take place independently – product changes are possible without downtime.
With up to four spray heads, five bottom heating modules (with optional convection heating at the top) and a fully modular design, the VERSAFLOW 3/66 integrates effortlessly into modern inline production lines. The result: highest soldering quality, maximum throughput and absolute process reliability, even with large and complex assemblies.
Specifications
| Dimensions | 2.950 x 1.900 x 1.650 mm |
| PCB width | 63,5-610 mm |
| PCB length | 127-610 mm |
| Maximum PCB | build-up at the top up to 120 mm |
| Maximum PCB | build-up at the bottom up to 60 mm (30 mm with z-variable modules) |
| Maximum PCB weight | 5 kg (optional 15 kg) |
| Modules | Flux module / Preheat module / Solder module |
The VERSAFLOW 3/66 is part of the third generation of Ersa systems and has been specially developed for selective soldering of large printed circuit boards up to 610 x 610 mm. This high-end soldering system combines maximum flexibility with excellent process stability – ideal for demanding electronics production in the XL segment.
Depending on the soldering task and desired throughput, the VERSAFLOW 3/66 can be expanded with additional flux, preheating, and soldering modules. Up to three soldering modules can be integrated, each equipped with one or two single-wave pots for optimal configuration per application.
The machine offers both mini-wave soldering technology for maximum precision and multi-wave options for high-volume production. Thanks to the parallel process structure – in which fluxing, preheating, and soldering take place independently – product changes are possible without downtime.
With up to four spray heads, five bottom heating modules (with optional convection heating at the top) and a fully modular design, the VERSAFLOW 3/66 integrates effortlessly into modern inline production lines. The result: highest soldering quality, maximum throughput and absolute process reliability, even with large and complex assemblies.
| Type | Selective soldering |
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