Asscon - Vapor Phase Soldering Machine VP810
ASSC-1150000
Powerful vapor phase soldering machine for those who demand absolute process reliability when soldering prototypes, small series, or test assemblies
Asscon - Vapor Phase Soldering Machine VP810
ASSC-1150000
Powerful vapor phase soldering machine for those who demand absolute process reliability when soldering prototypes, small series, or test assemblies
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Need a quote, installation, or training?
Call +32 (0)14 42 44 01 or contact us
Nick Janssen
Product specialist
Description
The VP510 utilizes two-chamber technology with separate soldering and cooling zones. This keeps your process stable and clean, while completely avoiding oxidation. Integrated sensors for liquid, vapor, and heating elements give you constant control over the soldering process. The TGC (Temperature Gradient Control) provides adjustable temperature profiles, and the ASB (Automatic Solder Break) system stops automatically once the process is complete — safely and efficiently.
Compact, mobile, and ready to use
With a workpiece carrier measuring 450 x 450 mm and a maximum height of 100 mm, the VP510 offers space for a wide range of PCB sizes. The machine operates on a standard 240 V connection, consumes 3.2 kW, and can be easily moved thanks to its robust swivel casters. The closed cooling system means you don’t need any fixed connections, so you can use the machine anywhere — ideal for lab environments, training courses, and R&D departments.
Intelligent operation and process control
The VP510 is equipped with a micro-PLC and 3.5″ color touchscreen on which you can store up to ten soldering programs. You can visually monitor the process through the inspection window (OPC – Optical Process Control). Automatic recognition of the process medium and liquid level monitor the quality of each cycle. Thanks to the short warm-up time and the Quick Start function, the machine is quickly operational, with minimal energy consumption in standby mode.
Homogeneous heat distribution, perfect results
ASSCON’s vapor phase technology ensures completely even heat distribution, regardless of the size or density of your assembly. Because the temperature never exceeds the boiling point of the medium, you eliminate the risk of overheating, delamination, or damage to sensitive components. Even complex 3D PCBs are soldered smoothly and reproducibly — every time.
Specifications
| Average power consumption in production | 1,3 kWh |
| Average power consumption in standby | 0,5 kWh |
| CE: Energy supply 1P+N+PE | 240 VAC; 50 Hz |
| Connection Power / Connection power incl. cooling | 2,9 kW / 3,35 kW |
| Max. height of solder product | 100 mm |
| Medium basic filling quantity | 3 kg |
| Medium consumption ca. | 3 g/cycle |
| Standard cycle time | Approx. 10 min. |
| Work piece carrier size | 450 x 450 mm |
Downloads
The VP510 utilizes two-chamber technology with separate soldering and cooling zones. This keeps your process stable and clean, while completely avoiding oxidation. Integrated sensors for liquid, vapor, and heating elements give you constant control over the soldering process. The TGC (Temperature Gradient Control) provides adjustable temperature profiles, and the ASB (Automatic Solder Break) system stops automatically once the process is complete — safely and efficiently.
Compact, mobile, and ready to use
With a workpiece carrier measuring 450 x 450 mm and a maximum height of 100 mm, the VP510 offers space for a wide range of PCB sizes. The machine operates on a standard 240 V connection, consumes 3.2 kW, and can be easily moved thanks to its robust swivel casters. The closed cooling system means you don’t need any fixed connections, so you can use the machine anywhere — ideal for lab environments, training courses, and R&D departments.
Intelligent operation and process control
The VP510 is equipped with a micro-PLC and 3.5″ color touchscreen on which you can store up to ten soldering programs. You can visually monitor the process through the inspection window (OPC – Optical Process Control). Automatic recognition of the process medium and liquid level monitor the quality of each cycle. Thanks to the short warm-up time and the Quick Start function, the machine is quickly operational, with minimal energy consumption in standby mode.
Homogeneous heat distribution, perfect results
ASSCON’s vapor phase technology ensures completely even heat distribution, regardless of the size or density of your assembly. Because the temperature never exceeds the boiling point of the medium, you eliminate the risk of overheating, delamination, or damage to sensitive components. Even complex 3D PCBs are soldered smoothly and reproducibly — every time.
