Description

The vapor phase soldering systems of the VP800-series are designed as compact Stand-alone-systems. They are particularly suitable for users, processing applications with frequently changing products in small-batch production. Due to the universal applicability, the systems are also very good applicable in prototyping and laboratory, as well as process qualification. The assemblies to be processed are transferred through the system on an universal work piece carrier. Thereby, those systems can be deployed very flexibly, especially with high product diversity and smaller unit quantities. Equipped with the optional vacuum module, void rates below far below 1% can be achieved.

The Asscon VP800 represents

• Excellent soldering quality
• Simple and efficient soldering of assemblies with different thermal requirements
• Reliable soldering, also with particularly heavy, high mass assemblies and 3D assemblies
• Automatic control and monitoring of each soldering via Sensor Based Profiling (Sensor Based Profiling will be deactivated by using vacuum.)
• Minimum space requirement because of compact design, which allows operation in each electronic manufacturing with a footprint of approx. 1 m² and a maximum soldering area of 460 x 610 mm
• Very good energy efficiency with an average energy consumption with less than 3 kWh in the running production.

Vapor phase reflow soldering

• Means electronic manufacturing without changeover- and setup time during product change
• Creates high availability for the production
• Enables 100% First Pass Yield
• Is the ideal production process for batch-size-1-production
• Provides significant reduction of production costs due to process-related low energy consumption  

Specifications