Asscon - Vapor Phase Soldering Machine VP810

ASSC-1181000

Stand-Alone systems for small series production, prototyping und labratory

Asscon - Vapor Phase Soldering Machine VP810

ASSC-1181000

Stand-Alone systems for small series production, prototyping und labratory

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    • Independent expertise
    • Customers give us a 9+
    • Extensive offer
    • More than 45 years of experience

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      • Independent expertise
      • Customers give us a 9+
      • Extensive offer
      • More than 45 years of experience

      Need assistance, installation and/or training?
      Call +32 (0)14 42 44 01 or contact us

      Contact us

      In need direct contact with a sales representative?

      Nick Janssen

      Product specialist

      +31 0612345678

        Or leave your details and we will contact you as soon as possible.

        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        • Independent expertise
        • Customers give us a 9+
        • Extensive offer
        • More than 45 years of experience
        SKU: ASSC-1181000 Categories: , ,
        Asscon

        Description

        The vapor phase soldering systems of the VP810-series are designed as compact Stand-alone-systems. They are particularly suitable for users, processing applications with frequently changing products in small-batch production. Due to the universal applicability, the systems are also very good applicable in prototyping and laboratory, as well as process qualification. The assemblies to be processed are transferred through the system on an universal work piece carrier. Thereby, those systems can be deployed very flexibly, especially with high product diversity and smaller unit quantities. Equipped with the optional vacuum module, void rates below far below 1% can be achieved.

        The ASSCON VP810 represents

        • Cost effective vapor phase soldering system
        • Excellent soldering quality
        • Simple and efficient soldering of assemblies with different thermal requirements
        • Reliable soldering, also with particularly heavy, high mass assemblies and 3D assemblies
        • Automatic control and monitoring of each soldering via Sensor Based Profiling New: With the VP810, Sensor Based Profiling is now also active in vacuum mode and thus enables the precise profiling of assemblies.
        • Minimum space requirement because of compact design, which allows operation in each electronic manufacturing with a footprint of approx. 1 m² and a maximum soldering area of 610 x 460 mm (as vacuum version 480 x 295 mm).
        • Very good energy efficiency with an average energy consumption with less than 3 kWh in the running production.
        • New feature: Advanced Management Interface (AMI for short) – External solder profile creation and processing flexibly via external PC (PC not included in scope of delivery)

        Vapor phase reflow soldering

        • Means electronic manufacturing without changeover- and setup time during product change
        • Creates high availability for the production
        • Enables 100% First Pass Yield
        • Is the ideal production process for batch-size-1-production
        • Provides significant reduction of production costs due to process-related low energy consumption
        • Under vacuum void rates of <1 % are possible

         

        Specifications

        Max. assembly size610 x 460mm
        Max. solder height60mm
        Max. assembly height100mm
        Average power consumption (Full load)2,5 kW
        Average power consumption (Standby)1,8W
        Average cycle time8 - 12 min.

        The vapor phase soldering systems of the VP810-series are designed as compact Stand-alone-systems. They are particularly suitable for users, processing applications with frequently changing products in small-batch production. Due to the universal applicability, the systems are also very good applicable in prototyping and laboratory, as well as process qualification. The assemblies to be processed are transferred through the system on an universal work piece carrier. Thereby, those systems can be deployed very flexibly, especially with high product diversity and smaller unit quantities. Equipped with the optional vacuum module, void rates below far below 1% can be achieved.

        The ASSCON VP810 represents

        • Cost effective vapor phase soldering system
        • Excellent soldering quality
        • Simple and efficient soldering of assemblies with different thermal requirements
        • Reliable soldering, also with particularly heavy, high mass assemblies and 3D assemblies
        • Automatic control and monitoring of each soldering via Sensor Based Profiling New: With the VP810, Sensor Based Profiling is now also active in vacuum mode and thus enables the precise profiling of assemblies.
        • Minimum space requirement because of compact design, which allows operation in each electronic manufacturing with a footprint of approx. 1 m² and a maximum soldering area of 610 x 460 mm (as vacuum version 480 x 295 mm).
        • Very good energy efficiency with an average energy consumption with less than 3 kWh in the running production.
        • New feature: Advanced Management Interface (AMI for short) – External solder profile creation and processing flexibly via external PC (PC not included in scope of delivery)

        Vapor phase reflow soldering

        • Means electronic manufacturing without changeover- and setup time during product change
        • Creates high availability for the production
        • Enables 100% First Pass Yield
        • Is the ideal production process for batch-size-1-production
        • Provides significant reduction of production costs due to process-related low energy consumption
        • Under vacuum void rates of <1 % are possible

         

        Type

        Vapor Phase Soldering – Batch