In-line automated 3D X-ray inspection system 3Xi-M200
Inline 3D-CT Automated X-ray Inspection Systems
In-line automated 3D X-ray inspection system 3Xi-M200
Inline 3D-CT Automated X-ray Inspection Systems
Beschrijving
Saki’s 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
Saki’s unique “Planar CT” technology
– Acquires high-quality CT images of planar objects using fewer projections
– Identifies various defects in 3D images
Intuitive User-friendly software
– High accuracy true 3D automatic inspection
– Displays actual measurement and target point with 3D images
– Displays defects in high-precision 3D color images
Expands the range of inspection
– Inspection of standard PCBs, components and solder joints, and other electric components
– Head in Pillow (HIP)
– Detection and measurement of voids in multilayer PCB power modules.
Specifications
Size (WxDxH) | 1380 x 2150 x 1862 mm |
Weight approx. | 5200 Kg |
Electric power requirement | Single-phase ~ 200-240V +/-10%, 50/60Hz |
Resolution | 51μm - 104μm |
Tube | 180kV 90W, Closed X-ray Tube |
Xray leakage | 0.5μSv/h or less |
Air requirement | 0.5MPa, 5 l/min (ANR) |
Target board size in mm | 50 W x 140 L / 460 W x 440 L - 50 W x 140 L / 460 W x 600 L |
PCB clearance | Top 68mm, Bottom 40mm |
Saki’s 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
Saki’s unique “Planar CT” technology
– Acquires high-quality CT images of planar objects using fewer projections
– Identifies various defects in 3D images
Intuitive User-friendly software
– High accuracy true 3D automatic inspection
– Displays actual measurement and target point with 3D images
– Displays defects in high-precision 3D color images
Expands the range of inspection
– Inspection of standard PCBs, components and solder joints, and other electric components
– Head in Pillow (HIP)
– Detection and measurement of voids in multilayer PCB power modules.