Automated wire confection: Is your department up to speed yet?

Are you facing a shortage of technically skilled staff, high labour costs or competition from Eastern Europe? Do you find it difficult to achieve the expected quality of your final product? Then it’s time to look at automated wire confection solutions! Why automate? Automation offers numerous benefits for your wire assembly: Efficiency improvement: Repetitive tasks...

What are Lead-free, low melting point solder alloys?

The melting points of typical lead free solder alloys are situated in the 217 to 227°C range, depending the ratio of the main alloy’s metals; Sn, Ag and Cu. In comparison with the old tin-lead (SnPb) alloys these melting points of standard lead-free alloys are 40 to 50°C higher. For a number of components and...

Why Step Stencils are indispensable in your PCB assembly

Miniaturization of electronic devices and components is a real trend. Designers are constantly working on the edge of the physical limits of manufacturability. As a result of this the apertures in stencils are always getting smaller. Who still remembers the times that a chip component of 2 by 3mm was really small? Nowadays components of...

Become a process expert in Stencilprinting!

In this webinar we will discuss the topic Stencilprinting: → How to avoid mistakes in an SMD assembly process → What are the most important parameters and conditions → What does scooping, slump, printgap and release have to do with stencilprinting → Interflux discusses the types of solder paste, the pre-mixing and handling process This...

Become a process expert in Selective Soldering!

In this webinar we will discuss the topic Selective Soldering: → How to make a good solder joint → What influence do soldering speed, soldering height, choice of nozzle, flux and alloy have → Interflux discusses with you the types of fluxes and the need for adapted fluxes This webinar is only in Dutch, please...

Become a process expert in BGA Rework!

In this webinar we will discuss the topic BGA Rework: → How to desolder a defective BGA from a printed circuit board → How to clean and prepare the PCB to insert a new BGA → How to apply flux or paste → Which fluxes can be used, what are their characteristics, advantages and disadvantages...

The World of Labeling and Marking

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities. Do you want to know how to take your production processes of Labeling & Marking to the next level? Then watch this...

The World of Cutting, Stripping and Shrinking

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities. Do you want to know how to take your production processes of Cutting, Stripping & Shrinking to the next level? Then watch...

The World of Crimping, Connecting & Quality

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities. Do you want to know how to take your production processes of crimping, connecting & quality to the next level? Then watch...

The World of Automation and Applications

A while ago, we organised a virtual journey through the four worlds of cable and wire processing. In a series of four webinars, we discussed exciting topics and offered a clear view of the possibilities. Do you want to know how to take your production processes of Automation & Applications to the next level? Then watch this...

Pin-hole ratio: What is the influence on liquid tin and what ratio is ideal?

Pin-hole ratio With through hole components, the connection pins go through a PCB. The space between a connecting pin and the hole in the PCB will determine the capillary effect. This effect ensures that the flux and liquid tin are ‘sucked’ up into the space between the pin and the hole. A good pin to...

What are halogens doing in a flux and what danger do they pose?

Halogens in a flux Halogens are chemical elements that have the property of reducing metals efficiently. In the process, metal salts are formed that are usually very soluble in water and also attract and retain moisture from the environment. Moisture and metal salts together create an electrically conductive medium. This significantly increases the chance of electromigration...

What is voiding and does the reflow profile affect it?

Voiding A phenomenon that occurs in the reflow soldering process. Bubbles (voids) begin to form in the flowed and solidified solder which make the solder joint hollow to a certain extent. Cause of voiding The cause of this phenomenon can be found in the outgassing of substances used in the various components, materials and PCBs....

How to avoid tombstoning during PCB assembly

Tombstoning A situation that occurs during the reflow soldering process, especially in a vapour phase or vapour phase reflow system. It means that passive chip components such as resistors and condensers stand upright during soldering.   The cause of tombstoning     The cause of this problem is to be found in the accidental flow of solder paste on the two...

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